STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it is essential to follow the recommended derating curves for voltage and current, and to ensure that the device is properly cooled. Additionally, the device should be operated within the recommended junction temperature range of -40°C to 150°C.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/s. It is essential to follow the recommended soldering profile to prevent damage to the device.
To protect the device from ESD, it is essential to handle the device with anti-static precautions, such as using an anti-static wrist strap or mat. The device should also be stored in an anti-static bag or container when not in use.
STMicroelectronics recommends storing the device in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The device should be stored in its original packaging or an anti-static bag to prevent damage.
STTH1002CR datasheet
by STMicroelectronics
