A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB surface clean and flat.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STTH1002CGY-TR). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly.
The recommended soldering conditions for the STTH1002CGY-TR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. Use a soldering iron with a temperature range of 200-240°C, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
To handle ESD protection for the STTH1002CGY-TR, ensure that all personnel handling the device wear ESD-protective wrist straps or clothing, and that all equipment and work surfaces are grounded. Use ESD-protective packaging and storage materials, and avoid touching the device's pins or leads.
The recommended storage conditions for the STTH1002CGY-TR are: temperature range of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or in a dry, clean environment.
STTH1002CGY-TR datasheet
by STMicroelectronics
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