STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device temperature within the recommended range.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a no-clean flux and a solder alloy with a melting point above 217°C (423°F).
To prevent electrostatic discharge (ESD) damage, handle the device by the body or pins, and avoid touching the pins or die. Use an ESD wrist strap or mat, and ensure that the workstation and equipment are ESD-protected. The device has built-in ESD protection, but additional external protection may be necessary depending on the application.
Store the device in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C (-40°F to 257°F), and the relative humidity should be below 60%. Use anti-static packaging and avoid bending or flexing the leads.
STS3C2F100 datasheet
by STMicroelectronics
