STMicroelectronics provides a recommended PCB layout in their application note AN2349, which includes guidelines for thermal management and PCB design.
To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal management guidelines in the datasheet, including using a heat sink and ensuring good airflow. Additionally, consider using a thermal interface material to improve heat transfer between the device and heat sink.
STMicroelectronics recommends following the soldering conditions outlined in their application note AN2350, which includes guidelines for reflow soldering, wave soldering, and hand soldering.
First, verify that the device is properly powered and that the input voltage is within the recommended range. Check for any signs of physical damage or overheating. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines or contact STMicroelectronics support for further assistance.
To prevent electrostatic discharge (ESD) damage, it is recommended to follow proper ESD handling procedures, including using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
STR911FAW44X6T datasheet
by STMicroelectronics
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