STMicroelectronics recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array with a minimum of 10 vias under the package to ensure optimal heat dissipation.
To ensure reliable operation in high-temperature environments, it is recommended to follow the derating guidelines provided in the datasheet, and to implement adequate thermal management, such as heat sinks or fans, to keep the junction temperature below the maximum rated value.
STMicroelectronics recommends soldering this device using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. Hand soldering is not recommended due to the device's small size and high pin count.
To prevent electrostatic discharge (ESD) damage, it is recommended to handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper grounding procedures during assembly and testing.
The recommended power sequencing and startup procedures can be found in the application note AN5275 from STMicroelectronics, which provides detailed guidelines for powering up and configuring the STPSC1006G-TR device.
STPSC1006G-TR datasheet
by STMicroelectronics
