A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended for optimal thermal performance. The thermal vias should be connected to the ground plane to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, the device should be operated within the specified junction temperature range (TJ) of -40°C to 150°C.
The recommended input capacitor value is 10uF to 22uF, and the type should be a low-ESR ceramic capacitor (X5R or X7R dielectric) to ensure stable operation and minimize voltage ripple.
The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
The recommended output capacitor type is a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10uF to 22uF. This ensures stable operation and minimizes voltage ripple.
STPSC10065D datasheet
by STMicroelectronics
Findchips
