STPS61H100CWY datasheet by STMicroelectronics

STPS61H100CWY Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics provides a recommended PCB layout in the application note AN5046, which includes guidelines for thermal pad connection, copper thickness, and via placement to ensure optimal thermal performance.
• How do I calculate the power dissipation of the STPS61H100CWY?
  The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet or the application note AN5046. Additionally, the thermal resistance (RthJA) and junction temperature (Tj) should be considered to ensure the device operates within the safe operating area.
• What is the maximum allowed voltage ripple on the input and output?
  The maximum allowed voltage ripple on the input and output is not explicitly stated in the datasheet. However, as a general guideline, it's recommended to keep the input voltage ripple below 10% of the nominal input voltage and the output voltage ripple below 1% of the nominal output voltage to ensure stable operation.
• Can I use the STPS61H100CWY in a high-reliability or automotive application?
  Yes, the STPS61H100CWY is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is designed to operate in harsh environments. However, it's essential to follow the recommended design guidelines and testing procedures to ensure the device meets the specific application requirements.
• How do I ensure electromagnetic compatibility (EMC) with the STPS61H100CWY?
  To ensure EMC, follow the guidelines in the application note AN5046, which provides recommendations for PCB layout, component selection, and shielding. Additionally, consider using electromagnetic interference (EMI) filters and shielding on the input and output lines to minimize radiation and susceptibility.