A good thermal design should be used to ensure optimal heat dissipation. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB, and multiple vias should be used to connect the thermal pad to the copper area to reduce thermal resistance.
To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, a good thermal design and a suitable heat sink should be used to keep the junction temperature within the recommended range.
The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (X5R or X7R dielectric) is recommended. The capacitor should be placed as close as possible to the input pins of the device.
To protect the device from overvoltage and overcurrent, it is recommended to use a TVS (Transient Voltage Suppressor) diode and a fuse or a PTC (Positive Temperature Coefficient) thermistor in series with the input voltage. Additionally, a current limiter or a fuse can be used to protect the device from overcurrent.
The recommended output capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (X5R or X7R dielectric) is recommended. The capacitor should be placed as close as possible to the output pins of the device.
STPS5H100B datasheet
by STMicroelectronics
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