STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, and consider using a heat sink or thermal interface material if necessary.
A ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 50V or higher is recommended. The capacitor should be placed as close as possible to the VIN pin.
Implement overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients. A zener diode or a dedicated OVP/UVP IC can be used for this purpose.
A ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 10V or higher is recommended. The capacitor should be placed as close as possible to the VOUT pin.