A good PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other layers of the PCB.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
The maximum allowed voltage on the gate pin is 20V, as specified in the datasheet. Exceeding this voltage may damage the device.
To protect the device from ESD, handle the device by the body or use an anti-static wrist strap, and store the device in an anti-static bag or container. Ensure the PCB and assembly process also follow ESD-safe practices.
The recommended gate resistor value depends on the specific application and switching frequency. A typical value is in the range of 10Ω to 100Ω, but it's recommended to consult the application note or a qualified engineer for a specific design.
STPS20H100CGY-TR datasheet
by STMicroelectronics
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