A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a thermal via array can also help to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure good thermal management, use a suitable heat sink, and avoid overheating the device.
To prevent electrostatic discharge (ESD) damage, handle the device in an ESD-protected environment, use ESD-protected workbenches and tools, and ensure that your body and clothing are properly grounded. Avoid touching the device's pins or leads, and use anti-static packaging and storage materials.
When selecting an input capacitor, consider the device's input capacitance requirements, the operating frequency, and the desired ripple voltage. A general rule of thumb is to choose a capacitor with a capacitance value between 1-10 μF, and a voltage rating that exceeds the maximum input voltage.
To minimize EMI, follow good PCB design practices, such as keeping the device's switching nodes away from sensitive analog circuits, using a solid ground plane, and minimizing loop areas. Additionally, use shielding, filtering, and decoupling capacitors to reduce EMI emissions.
STPS20H100CG-TR datasheet
by STMicroelectronics
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