STMicroelectronics recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal via array with a minimum of 10 vias under the package to ensure optimal thermal performance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal interface material (TIM) between the device and heat sink. Additionally, consider using a thermal monitoring system to prevent overheating.
The maximum allowed voltage on the input pins is 30V, but it's recommended to keep the input voltage below 25V to ensure reliable operation and prevent damage to the device.
To protect the device from overcurrent and overvoltage conditions, use a suitable fuse or current limiter on the input, and consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
The recommended input capacitor value is 10uF to 22uF, and it's recommended to use a low-ESR ceramic or film capacitor to ensure optimal performance and minimize voltage ripple.
STPS20120CR datasheet
by STMicroelectronics
