STPS10L25G-TR datasheet by STMicroelectronics

STPS10L25G-TR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the STMicroelectronics application note AN5275 for more details.
• How do I ensure the device is properly biased for optimal performance?
  The device requires a stable input voltage (VIN) and a bypass capacitor (CBYP) to ensure proper biasing. A 10uF ceramic capacitor is recommended for CBYP, and VIN should be decoupled with a 1uF ceramic capacitor.
• What is the maximum allowed voltage on the output pins?
  The maximum allowed voltage on the output pins is 25V. Exceeding this voltage may damage the device.
• How do I protect the device from overcurrent and overheating?
  Implement overcurrent protection (OCP) and overtemperature protection (OTP) circuits to prevent damage from excessive current and temperature. The device has a built-in thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C.
• What is the recommended input capacitor value and type for the device?
  A 10uF to 22uF ceramic capacitor is recommended for the input capacitor (CIN). The capacitor should be rated for the maximum input voltage and have a low equivalent series resistance (ESR) to minimize voltage ripple.