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    Part Img STP7NK30Z datasheet by STMicroelectronics

    • N-Channel 300 V-0.80 ohm-5 A TO-220 Zener-Protected SuperMESH Power MOSFET
    • Original
    • Yes
    • Yes
    • Obsolete
    • EAR99
    • Find it at Findchips.com

    STP7NK30Z datasheet preview

    STP7NK30Z Frequently Asked Questions (FAQs)

    • The maximum safe operating area (SOA) of the STP7NK30Z is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal characteristics and voltage ratings. As a general rule, it's recommended to operate the device within the specified voltage and current ratings to ensure safe operation.
    • To calculate the junction temperature of the STP7NK30Z, you can use the following formula: Tj = Ta + (Pd x Rthja), where Tj is the junction temperature, Ta is the ambient temperature, Pd is the power dissipation, and Rthja is the thermal resistance from junction to ambient. The thermal resistance values can be found in the datasheet.
    • To minimize thermal resistance, it's recommended to use a PCB layout that maximizes the copper area and minimizes the thermal resistance between the device and the heat sink. A good practice is to use a large copper pad under the device, and to connect it to a heat sink or a thermal via. The datasheet provides some general guidelines for PCB layout, but it's recommended to consult with a thermal expert or use thermal simulation tools for optimal design.
    • The STP7NK30Z is a power MOSFET designed for high-voltage and high-current applications, but it may not be suitable for high-frequency switching applications due to its relatively high gate charge and output capacitance. The datasheet provides some information on the device's switching characteristics, but it's recommended to consult with an application engineer or use simulation tools to determine the device's suitability for high-frequency switching applications.
    • To ensure the reliability of the STP7NK30Z in a high-reliability application, it's recommended to follow the device's recommended operating conditions, use a robust PCB design, and implement adequate thermal management. Additionally, it's recommended to perform thorough testing and validation of the device in the specific application, and to consult with a reliability expert or use reliability simulation tools to identify potential failure modes and mitigate risks.
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