STMPS2262TTR datasheet by STMicroelectronics

STMPS2262TTR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the STMPS2262TTR?
  STMicroelectronics provides a recommended PCB layout in the application note AN5012, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
• How do I handle the thermal dissipation of the STMPS2262TTR?
  The STMPS2262TTR has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
• What is the maximum operating temperature range for the STMPS2262TTR?
  The STMPS2262TTR is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability.
• How do I configure the STMPS2262TTR for low-power mode?
  The STMPS2262TTR has a shutdown pin (SHDN) that can be used to put the device in low-power mode. When SHDN is pulled low, the device enters a low-power state, reducing current consumption to less than 1 μA.
• What is the recommended input capacitor value for the STMPS2262TTR?
  The recommended input capacitor value for the STMPS2262TTR is 10 μF to 22 μF, with a voltage rating of at least 6.3 V. A larger capacitor value can be used to improve input ripple rejection and stability.