A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to use a thermal pad on the bottom of the device.
Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power dissipation at high temperatures.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
Use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke to reduce EMI. Also, ensure that the PCB layout is optimized for minimal radiation and that the device is placed away from sensitive circuits.
A 10uF to 47uF X7R or X5R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.