STMicroelectronics provides a recommended PCB layout in the application note AN5275, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The STL128DN has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
The maximum operating frequency of the STL128DN is 100 MHz, but it can be overclocked up to 120 MHz with proper thermal management and power supply design.
The STL128DN has several low-power modes, including sleep mode, standby mode, and shutdown mode. These modes can be configured using the device's registers and can help reduce power consumption when the device is not in use.
STMicroelectronics recommends using a 10 uF ceramic capacitor and a 1 uF ceramic capacitor in parallel, placed as close as possible to the device's power pins, to decouple the power supply and reduce noise.
STL128DN datasheet
by STMicroelectronics
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