STMicroelectronics provides a recommended PCB layout in the application note AN5046, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
The STGWT30H65FB requires a gate driver with a minimum output current of 2A and a voltage rating of at least 15V. STMicroelectronics recommends using their own gate driver ICs, such as the STGAP1S or STGAP2S, which are specifically designed for use with their IGBT modules.
The STGWT30H65FB has an internal overcurrent protection (OCP) feature that trips at 30A. However, it's recommended to implement an external OCP circuit to ensure reliable operation and prevent damage to the module. The datasheet provides guidelines for designing an external OCP circuit.
The STGWT30H65FB has a built-in isolation voltage of 2500Vrms, but it's still essential to ensure proper isolation and creepage distance in the PCB design. Follow the guidelines in the datasheet and relevant industry standards (e.g., IEC 60664-1) to ensure safe and reliable operation.
For high-power applications, forced air cooling or liquid cooling is recommended to maintain a safe junction temperature. The datasheet provides thermal resistance values and guidelines for calculating the required cooling system. Additionally, STMicroelectronics offers thermal simulation tools to help designers optimize their cooling systems.
