STMicroelectronics recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal shield to reduce the junction temperature.
Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, which is higher than the recommended VCC of 3.3V. However, it's crucial to ensure that the input voltage does not exceed the absolute maximum rating of 6.5V to prevent damage to the device.
To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and assembly procedures. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device pins or handling the device in a way that could generate static electricity.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device and ensure reliable operation.
STG3699AQTR datasheet
by STMicroelectronics
