A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. A 10uF input capacitor and a 22uF output capacitor are recommended.
Use a shielded enclosure, keep sensitive components away from the STD86N3LH5, and ensure good grounding and decoupling. Implement EMI filters and shielding on cables.
The maximum allowed voltage drop is 0.5V. Ensure that the input voltage is within the recommended range to maintain device reliability.