ST90R158Q6 datasheet by STMicroelectronics

ST90R158Q6 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to use a thermal pad on the bottom of the device.
• How do I ensure reliable operation at high temperatures?
  Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider using a thermal monitoring and shutdown circuit to prevent overheating.
• What are the key considerations for EMI and EMC compliance?
  Use a shielded enclosure, keep the device away from antennas and other EMI-sensitive components, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure that the PCB layout is optimized for minimal radiation and susceptibility.
• How do I select the right input and output capacitors?
  Choose input capacitors with low ESR and high ripple current capability. For output capacitors, select ones with low ESR and high capacitance to ensure stable output voltage. Consider using ceramic or film capacitors for their low ESR and high reliability.
• What are the critical parameters to monitor for fault detection and protection?
  Monitor the input voltage, output voltage, and current to detect faults such as overvoltage, undervoltage, and overcurrent. Also, consider monitoring the device temperature and using a thermal shutdown circuit to prevent overheating.