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    Part Img ST890CDR datasheet by STMicroelectronics

    • 1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN
    • Original
    • Yes
    • Unknown
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    ST890CDR datasheet preview

    ST890CDR Frequently Asked Questions (FAQs)

    • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
    • Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Ensure proper PCB design, component selection, and thermal interface material usage.
    • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF values, and for output capacitors, use 4.7uF to 10uF values.
    • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
    • The recommended input voltage range is 7V to 28V, with a maximum rating of 30V. Operating outside this range may affect device reliability and performance.
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