STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to keep the junction temperature below the maximum rating.
STMicroelectronics recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a reflow soldering process, and the soldering iron should not be applied directly to the device.
The ST755CD-TR is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you need to operate the device in a humid environment, consider using a conformal coating or potting the device to protect it from moisture.
The recommended input capacitor value is 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR ceramic capacitor, such as an X7R or X5R type, is recommended for optimal performance.
ST755CD-TR datasheet
by STMicroelectronics
