STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The ST3485EBN requires a stable power supply with adequate decoupling capacitors. A minimum of 10uF ceramic capacitor and 1uF film capacitor in parallel is recommended for each power pin. Additionally, ensure the power supply voltage is within the recommended range of 4.5V to 5.5V.
The ST3485EBN supports data transfer rates up to 100 Mbps, making it suitable for high-speed applications such as USB 2.0 and Ethernet.
The ST3485EBN can be configured for half-duplex or full-duplex operation by setting the appropriate pins and registers. Refer to the datasheet and application notes for specific configuration details.
The ST3485EBN has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat dissipation through a heat sink, thermal vias, and a well-designed PCB layout.
ST3485EBN datasheet
by STMicroelectronics
