A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 125°C. Also, ensure that the device is operated within the recommended voltage and current ranges.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure that the PCB layout is optimized for minimal radiation. Additionally, use a common-mode choke or ferrite bead to filter the input voltage.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.