A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad connected to the ground plane.
To ensure proper biasing, connect the input voltage (VIN) to a stable DC power supply, and decouple it with a 10uF capacitor to ground. The enable pin (EN) should be connected to a logic signal or tied to VIN if not used. The output voltage (VOUT) should be decoupled with a 10uF capacitor to ground, and the output should not be loaded with a capacitor larger than 10uF.
The maximum input voltage that can be applied to the device is 36V, but it's recommended to keep it below 35V to ensure reliable operation and to prevent damage to the device.
The device has built-in overcurrent protection (OCP) and thermal shutdown (TSD) features. However, it's recommended to add external protection such as a fuse or a PTC thermistor to prevent overcurrent and overheating. Additionally, ensure good airflow around the device and avoid blocking the thermal pad.
The device is rated for operation up to 150°C, but it's recommended to derate the output current and input voltage as the temperature increases. Consult the datasheet for thermal derating curves and ensure good airflow around the device to prevent overheating.
ST1S06PU33R datasheet
by STMicroelectronics
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