A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended for optimal thermal performance. The thermal vias should be connected to the ground plane to dissipate heat efficiently.
To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF with an ESR of 1ohm or less. Additionally, the output voltage should be decoupled with a 10nF ceramic capacitor.
The maximum input voltage that can be applied to the device is 26V. Exceeding this voltage may damage the device.
The device has a built-in overcurrent protection (OCP) feature that limits the output current to 2.5A. However, it is recommended to add an external fuse or PTC thermistor to protect the device from overcurrent conditions.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ripple.
ST1S06APUR datasheet
by STMicroelectronics
