STMicroelectronics recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern around the device to ensure optimal thermal performance. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and consider derating the device's power dissipation according to the ambient temperature.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially cause permanent damage to the device. It's crucial to ensure the device operates within the recommended temperature range.
To troubleshoot issues related to output voltage regulation, check the input voltage, output load, and feedback resistors. Ensure the feedback resistors are correctly connected and the output voltage is within the specified range. Also, verify that the device is not operating in dropout mode.
To minimize EMI and RFI, use a shielded layout, keep the input and output traces short, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure the device is properly decoupled and the PCB is designed with EMI and RFI in mind.
ST1480ACD datasheet
by STMicroelectronics
