A recommended PCB layout for optimal thermal performance would be to use a large copper pad under the device, connected to a thermal via or a heat sink. This helps to dissipate heat efficiently and reduce thermal resistance.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point above 217°C. Apply a small amount of solder paste or flux to the pads, and avoid overheating or applying excessive force during the soldering process.
Although the datasheet specifies a maximum voltage rating of 600V, it's essential to consider the voltage derating curve to ensure safe operation. As a general rule, it's recommended to operate the device at 80% of the maximum voltage rating or less to account for voltage spikes and transients.
To protect the device from ESD, handle the components in an ESD-safe environment, use ESD-safe packaging and storage materials, and ensure that all personnel handling the devices are grounded or wearing ESD-protective gear. Additionally, consider adding ESD protection circuits or devices in the system design.
Store the devices in their original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Handle the devices by the body or the leads, avoiding touching the sensitive surfaces or pins.
SS26SHE3/5AT datasheet
by Vishay Semiconductors
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