SS110 datasheet by Taiwan Semiconductor

SS110 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow.
• How do I ensure reliable operation across the full temperature range?
  Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Ensure proper mounting and screw torque to prevent thermal resistance.
• What is the maximum allowed voltage transient on the input pins?
  The maximum allowed voltage transient is ±20% of the recommended operating voltage for a duration of ≤100ms. Exceeding this may cause damage or malfunction.
• Can I use the SS110 in a high-humidity environment?
  Yes, but ensure the device is properly sealed or coated to prevent moisture ingress. Follow the recommended storage and handling procedures to prevent moisture absorption.
• How do I prevent electromagnetic interference (EMI) issues?
  Use a shielded enclosure, keep the device away from high-frequency sources, and ensure proper grounding and decoupling. Follow the recommended PCB layout and component placement guidelines.