A thermal pad is recommended under the SR210 package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern on the PCB are also recommended.
Ensure that the SR210 is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal management techniques such as heat sinks or fans.
Exceeding the maximum Tj rating can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the SR210 is operated within the recommended temperature range to maintain reliability.
Implement ESD protection measures such as using ESD-sensitive handling procedures, incorporating ESD protection devices (e.g., TVS diodes) on the PCB, and ensuring that the SR210 is properly grounded.
Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 240°C 10s. Ensure that the PCB is designed to withstand the soldering process.
