A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the SR110 package is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
Implement a robust thermal management system, including a heat sink, thermal interface material, and adequate airflow. Also, ensure that the SR110 is operated within its specified temperature range (–40°C to 125°C) and follow the recommended derating guidelines.
Use 10uF to 22uF ceramic capacitors with a voltage rating of 6.3V or higher, placed as close as possible to the SR110's power pins. Additional 100nF to 1uF capacitors can be added in parallel to filter high-frequency noise.
Implement a soft-start circuit or a current limiter to reduce inrush current during startup. For fault conditions, use a fuse or a current-limiting resistor in series with the power supply to prevent damage to the SR110.
Use ESD protection diodes (e.g., TVS or ESD arrays) on the input and output pins, and ensure that the PCB design follows ESD-safe handling and assembly practices.
