The recommended land pattern for the SPD62R-223M is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the pads and place the component. Use a reflow oven or a hot air gun to solder the component. Ensure the solder joints are smooth and shiny, with no signs of cold solder joints or solder balls.
The maximum operating temperature for the SPD62R-223M is 125°C. Operating the device above this temperature may reduce its reliability and lifespan.
Yes, the SPD62R-223M is designed to withstand high-vibration environments. However, it's essential to ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment.
Handle the SPD62R-223M with care to prevent damage. Store the components in their original packaging or a similar anti-static package. Avoid exposing the components to extreme temperatures, humidity, or physical stress during shipping and storage.
SPD62R-223M datasheet
by API Delevan
Findchips
