SP8K32HZGTB datasheet by ROHM Semiconductor

SP8K32HZGTB Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
• How do I ensure reliable operation in high-temperature environments?
  To ensure reliable operation in high-temperature environments, it's essential to follow ROHM's recommended thermal design guidelines, use a suitable heat sink, and consider derating the device's power consumption according to the ambient temperature.
• What is the maximum allowed voltage on the input pins?
  Although the datasheet doesn't specify a maximum allowed voltage, ROHM recommends limiting the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.
• Can I use the SP8K32HZGTB in a 3.3V system?
  Yes, the SP8K32HZGTB can be used in a 3.3V system, but the output voltage will be limited to 3.3V. ROHM recommends using an external voltage regulator or level shifter if a higher output voltage is required.
• How do I handle the power-on reset (POR) and brown-out detection (BOD) features?
  The POR and BOD features are enabled by default. To disable them, connect the POR/BOD pin to VCC through a 10kΩ resistor. For custom POR/BOD settings, consult ROHM's application notes and programming guides.