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SOT819-1
datasheet
by NXP Semiconductors
Description
Plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
Price & Stock
Find it at Findchips.com
SOT819-1
datasheet preview
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