Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SN75LBC179DG4 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour connected to a ground plane can be used to dissipate heat. Additionally, the device's thermal resistance can be reduced by using a heat sink or a thermal interface material.
The maximum cable length supported by the SN75LBC179DG4 depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
Texas Instruments provides a troubleshooting guide in the application note SLVAE03, which includes steps to identify and resolve common issues such as signal integrity problems, power supply issues, and device malfunction. Additionally, the device's built-in diagnostic features, such as the fault detection and reporting mechanism, can be used to identify and troubleshoot issues.
The recommended power supply decoupling capacitors for the SN75LBC179DG4 are 0.1 μF to 1 μF ceramic capacitors with a voltage rating of 10 V to 25 V, placed as close as possible to the device's power pins. Additionally, a 10 μF to 22 μF bulk capacitor can be used to filter out low-frequency noise.
SN75LBC179DG4 datasheet
by Texas Instruments
