SN75LBC170DBR datasheet by Texas Instruments

SN75LBC170DBR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the SN75LBC170DBR?
  Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
• How do I handle the thermal dissipation of the SN75LBC170DBR?
  The SN75LBC170DBR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour can be used to connect the thermal pad to the thermal plane. Additionally, the device can be mounted on a heat sink or a metal core PCB to further improve thermal dissipation.
• What is the maximum cable length supported by the SN75LBC170DBR?
  The maximum cable length supported by the SN75LBC170DBR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
• Can the SN75LBC170DBR be used in a point-to-point or multi-point configuration?
  The SN75LBC170DBR is designed for point-to-point applications, but it can also be used in multi-point configurations with the use of hubs or switches. However, the device's performance and reliability may be affected in multi-point configurations, and additional components may be required to ensure signal integrity.
• What is the ESD protection level of the SN75LBC170DBR?
  The SN75LBC170DBR has an ESD protection level of ±2 kV human-body model (HBM) and ±1 kV charged-device model (CDM) on the transmitter and receiver pins. This level of protection is sufficient for most industrial and commercial applications, but additional ESD protection may be required in harsh environments.