Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SN75DP129RHHR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour connected to a ground plane can be used to dissipate heat. Additionally, the device's thermal resistance (RθJA) is specified in the datasheet, which can be used to estimate the junction temperature.
The recommended input capacitance for the HDMI inputs is 50 pF to 100 pF, as specified in the HDMI 2.0 specification. This capacitance helps to filter out high-frequency noise and ensure signal integrity.
The SN75DP129RHHR can be configured for different HDMI data rates using the RATE pin. The RATE pin can be tied to VCC or GND to select between different data rates, such as 3.4 Gbps, 6.0 Gbps, or 12.0 Gbps. The specific configuration is described in the datasheet.
The maximum cable length supported by the SN75DP129RHHR depends on the HDMI data rate and the quality of the cable. As a general guideline, the device can support cable lengths up to 30 meters at 3.4 Gbps, 20 meters at 6.0 Gbps, and 10 meters at 12.0 Gbps. However, the actual cable length may vary depending on the specific application and environment.
SN75DP129RHHR datasheet
by Texas Instruments
