Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The SN75C189ADBRE4 has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via or a copper pour on the PCB can be used to dissipate heat. Additionally, the device's thermal resistance (RθJA) is specified in the datasheet, which can be used to estimate the junction temperature.
Although the datasheet specifies a recommended operating voltage range of 4.5V to 5.5V, it's recommended to operate the device within a narrower range of 4.75V to 5.25V to ensure optimal performance and minimize power consumption.
To ensure EMC, it's recommended to follow the guidelines in the application note SLVAE04, which includes recommendations for PCB layout, component selection, and shielding. Additionally, the device's electromagnetic susceptibility (EMS) is specified in the datasheet, which can be used to estimate the device's immunity to electromagnetic interference.
Although the datasheet specifies a maximum clock frequency of 100 MHz, the actual clock frequency that the device can support depends on the system design, PCB layout, and signal integrity. It's recommended to perform signal integrity analysis and simulation to determine the maximum clock frequency that the device can support in a specific system design.
SN75C189ADBRE4 datasheet
by Texas Instruments
