Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to the bottom layer to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
Exceeding the maximum junction temperature (TJ) can lead to reduced reliability, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain optimal performance and longevity.
When selecting input and output capacitors, consider the device's operating frequency, voltage, and current requirements. Choose capacitors with low equivalent series resistance (ESR) and a high ripple current rating to minimize voltage ripple and ensure stable operation.
To ensure EMI and EMC compliance, follow proper PCB layout and design guidelines, use shielding and filtering techniques, and consider the device's switching frequency and harmonics. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.
SN75240PWRG4 datasheet
by Texas Instruments
