Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, power supply decoupling, and thermal management.
The SN74LVCR32245AZKER has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad on the PCB can be used to improve heat dissipation.
The maximum operating frequency of the SN74LVCR32245AZKER is 250 MHz, but it can be limited by the system's signal integrity, PCB layout, and clock distribution network.
To ensure signal integrity, use controlled impedance traces, minimize signal routing distances, and use signal termination resistors as recommended in the application note SLVAE03. Additionally, use a clock signal with a rise time of less than 1 ns and a fall time of less than 1 ns.
Texas Instruments recommends using a 0.1 μF ceramic capacitor and a 10 μF tantalum capacitor in parallel, placed as close as possible to the power pins of the device.
SN74LVCR32245AZKER datasheet
by Texas Instruments
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