SN65LVELT23DR datasheet by Texas Instruments

SN65LVELT23DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for trace routing, component placement, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
• How do I handle the thermal dissipation of the device?
  The SN65LVELT23DR has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal via array or a copper pour can be used to connect the thermal pad to the ground plane, and thermal interface material (TIM) can be applied to improve heat transfer.
• What is the maximum cable length supported by the device?
  The maximum cable length supported by the SN65LVELT23DR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at data rates up to 1 Gbps, and up to 50 meters at data rates up to 3 Gbps.
• How do I configure the device for different data rates?
  The SN65LVELT23DR can be configured for different data rates using the RATE pin. The RATE pin can be tied to VCC or GND to select between 1 Gbps and 3 Gbps data rates. Additionally, the device can be configured using the I2C interface to select between different data rates and other operating modes.
• What is the power consumption of the device?
  The power consumption of the SN65LVELT23DR depends on the operating mode and data rate. In typical operating conditions, the device consumes around 150 mA at 1 Gbps and 250 mA at 3 Gbps. The device also has a low-power mode that can reduce power consumption to around 10 mA.