SN65C23243DLR datasheet by Texas Instruments

SN65C23243DLR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for trace routing, component placement, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
• How do I handle the thermal dissipation of the device?
  The SN65C23243DLR has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal via array or a thermal pad on the PCB can be used to improve heat dissipation. Additionally, the device should be placed in a well-ventilated area to prevent overheating.
• What is the maximum cable length supported by the device?
  The maximum cable length supported by the SN65C23243DLR depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 100 meters at a data rate of 100 Mbps. For longer cable lengths, repeaters or active cables may be required.
• How do I configure the device for half-duplex or full-duplex operation?
  The SN65C23243DLR can be configured for half-duplex or full-duplex operation by setting the appropriate pins and registers. For half-duplex operation, the TXEN pin should be tied low, and for full-duplex operation, the TXEN pin should be tied high. Additionally, the device's registers should be programmed to enable or disable the transmitter and receiver accordingly.
• What is the recommended power-up sequence for the device?
  The recommended power-up sequence for the SN65C23243DLR is to apply power to the VCC pin first, followed by the VCCIO pin. The power-up sequence should be controlled to ensure that the VCCIO pin is powered up after the VCC pin has reached a stable voltage. This ensures that the device powers up correctly and prevents any potential damage.