A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Ensure proper PCB design, and consider using a thermal interface material.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. Place the capacitor as close to the device as possible to minimize inductance.
Use a shielded enclosure, keep sensitive components away from the SMP75-8, and ensure proper PCB layout and grounding. Consider adding EMI filters or common-mode chokes if necessary.
The maximum allowed voltage drop is 1.5V. Ensure that the input voltage is within the recommended range to maintain device reliability and performance.