STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material (TIM) between the device and heat sink, and ensuring good airflow around the device. Additionally, consider derating the device's power consumption and operating frequency to reduce heat generation.
STMicroelectronics recommends soldering the SMP30-130 using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 30 seconds. The device should be soldered using a solder paste with a melting point of 217°C (423°F) or higher.
To handle ESD protection for the SMP30-130, it's essential to follow proper handling and storage procedures, such as using ESD-safe materials, grounding personnel, and using ESD-protective packaging. Additionally, consider implementing ESD protection circuits on the PCB, such as TVS diodes or ESD protection arrays.
STMicroelectronics recommends storing the SMP30-130 in a dry, cool place with a temperature range of -40°C to 125°C (-40°F to 257°F) and a relative humidity of 60% or less. The device should be stored in its original packaging or in a sealed, ESD-protective bag.
SMP30-130 datasheet
by STMicroelectronics
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