A good PCB layout for optimal thermal performance involves placing the SMP100LC-25 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB traces away from the thermal pad.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermal interface material (TIM) between the device and the heat sink, and ensuring good airflow around the device. Additionally, consider using a thermally-enhanced package or a heat spreader to reduce the thermal resistance.
The recommended soldering conditions for the SMP100LC-25 involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. The device should be soldered using a no-clean or water-soluble flux, and the soldering process should be done in a nitrogen atmosphere to prevent oxidation.
During storage and shipping, the SMP100LC-25 should be handled with care to prevent mechanical stress and electrostatic discharge (ESD). The device should be stored in its original packaging or in a protective container, and should be handled using ESD-safe materials and tools. Avoid bending, flexing, or dropping the device, and ensure that it is not exposed to extreme temperatures or humidity.
The SMP100LC-25 is manufactured according to STMicroelectronics' quality and reliability standards, which include compliance with international standards such as IEC, JEDEC, and AEC. The device is also subject to rigorous testing and inspection procedures to ensure its reliability and performance.
SMP100LC-25 datasheet
by STMicroelectronics
