SMLD12BN1WT86 datasheet by ROHM Semiconductor

SMLD12BN1WT86 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
• How do I ensure the device operates within the recommended operating conditions?
  Monitor the junction temperature (Tj) and ensure it stays below the maximum rating of 150°C. Also, ensure the input voltage (Vin) is within the recommended range of 2.5V to 5.5V.
• What is the recommended input capacitor value and type for stable operation?
  A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling, placed as close to the VIN pin as possible.
• How do I minimize electromagnetic interference (EMI) in my design?
  Use a shielded inductor, keep the switching node (SW pin) away from sensitive nodes, and use a common-mode choke or ferrite bead on the output to reduce EMI.
• What is the maximum output current capability of the device?
  The maximum output current is 1.2A, but it's recommended to derate the output current based on the ambient temperature and PCB thermal design.