A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
Use a secure mounting method, such as a screw or adhesive, to prevent the component from shifting or detaching during vibration. Additionally, consider using a vibration-dampening material, like a silicone adhesive, to reduce stress on the component.
The maximum allowable power derating is 50% at 125°C. This means that the component should not be operated above 50% of its maximum power rating at temperatures above 125°C to ensure reliable operation and prevent overheating.
Yes, but with precautions. The component is not hermetically sealed, so it's essential to apply a conformal coating to protect it from moisture. Additionally, ensure the PCB is designed with moisture-resistant materials and follow proper handling and storage procedures to minimize exposure to humidity.
A soldering profile with a peak temperature of 240°C to 250°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s to 6°C/s is recommended. This helps prevent thermal shock and ensures reliable solder joints.
SMBSAC5.0-TP datasheet
by Micro Commercial Components
Findchips
