SMBJP6KE6.8A-TP datasheet by Micro Commercial Components

SMBJP6KE6.8A-TP Frequently Asked Questions (FAQs)

• What is the recommended footprint for SMBJP6KE6.8A-TP?
  The recommended footprint for SMBJP6KE6.8A-TP is a standard SMB footprint with a pad size of 0.8mm x 1.8mm.
• Can SMBJP6KE6.8A-TP be used in high-reliability applications?
  Yes, SMBJP6KE6.8A-TP is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
• What is the maximum operating temperature range for SMBJP6KE6.8A-TP?
  The maximum operating temperature range for SMBJP6KE6.8A-TP is -55°C to 150°C.
• Is SMBJP6KE6.8A-TP compatible with lead-free soldering processes?
  Yes, SMBJP6KE6.8A-TP is compatible with lead-free soldering processes and meets the requirements of RoHS and WEEE directives.
• What is the typical response time for SMBJP6KE6.8A-TP?
  The typical response time for SMBJP6KE6.8A-TP is less than 1ns.