The recommended footprint and land pattern for SMBJ8.5A-TR can be found in the STMicroelectronics application note AN1232, which provides guidelines for PCB layout and assembly.
To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves for voltage and current, and to consider the device's thermal resistance and power dissipation. Additionally, ensure proper thermal management and heat sinking on the PCB.
While SMBJ8.5A-TR is primarily designed for low-frequency applications, it can be used in high-frequency circuits with proper consideration of the device's parasitic capacitance and inductance. However, it's recommended to consult with an STMicroelectronics application engineer or perform thorough simulations to ensure the device's performance meets the specific requirements.
When selecting an SMBJ8.5A-TR variant, consider the required breakdown voltage, clamping voltage, and peak pulse current. Also, ensure the device's power rating and thermal characteristics meet the application's requirements. Consult the datasheet and STMicroelectronics' selection guides for more information.
The SMBJ8.5A-TR has an ESD rating of 30 kV (human body model) and 15 kV (machine model). It's also designed to prevent latch-up, with a latch-up immunity of 100 mA. However, it's essential to follow proper PCB design and layout guidelines to ensure the device's ESD and latch-up performance.
SMBJ8.5A-TR datasheet
by STMicroelectronics
